Our “WIL” team has just expanded with the merger of Oasis Sales. Oasis, since its founding in 1975, has remained one of the country’s leading technology manufacturer representatives.
Our office is centrally located in Schaumburg, IL enabling us to serve the northern Illinois and Wisconsin markets. Since 1975, they have amassed a reputation for our technology prowess, customer service and attention to detail.
Together, our collective presence with customers in the market will create extended depth and elevates our value to our customers and distributor partners.
VP – Technical Sales & Engineering
Director – Sales Operations
Ceramic, Tantalum, Power Film Caps, Supercaps, RF Solutions, ATC, Thin Film, Circuit Protection, Connectors, Antennas, Passive & Active, Timing Devices, Crystal & SAW Devices, Connectors; High Density & Flat Flex Solutions
Embedded Boards, Mother Boards Computing Systems, Panel & Fanless Box PC, In-Vehicle and Railway computers. Rugged Tablets. Storage & Servers
Scalable Global Software Solutions; Simulation, Electromagnetics, Data, Fluid & Thermal, Electronics: Engineering Services
AC-DC Power Supplies - Open Frame, Modular, LED Drivers, Multi-output, Medical certified, Panel mount, DIN Rail, Custom Solutions
LCD display solutions; color TFT and monochrome, capacitive, resistive touch panels, embedded computing, smart displays. Value Added Assm
NOR and NAND Flash solutions for Industrial, Medical, Automotive, Computing and IoT applications
Offering Parallel and Serial flash products in 5V, 3V, 1.8V, 1.2V and Wide Vcc (1.65-3.6V) voltage options
Available in Industrial temp (-40 to 85C), Extended temp (-40 to 105C) and Automotive temperature grades
IC's for DC/DC and AC/DC power conversion, MPM DC/DC Power Modules, USB Charging, IC's for LED Lighting, IC's for Motor driving
NAND Flash Solid State Drives and Modules
Interface expertise SATA, PATA, DMA CFC, UDMA CFC, USB, and SD Flash Products
Unique Chip-On-Board (COB) technology
Extended and Industrial temperature grade
Heat Sinks; extruded, stacked fin, bonded fin, liquid cold plates, heat pipes, board-level semiconductor cooling. Structural extrusions. Electronic packaging; cases, racks